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1.27mm Pitch 8Byte DIMM Socket
SX4 Series
sFeatures
1. 8Byte DIMM Compliant Socket
The SX4 series are a socket compliant to "8Byte DIMM" standardized at JEDEC.
2. JEDEC Standard MO-161
The applicable module board 1.27mm pitch 168 pos. for double-sided connection.
3. Easy PC Board Pattern Design
The lead length for soldering dip connection on the board is 1.27mm, row-row 1.27mm, 1.6mm, 1.905mm, and staggered alignment in 4 rows.
4. Compatible with 5V and 3.3V Operating Voltage Module Board 5. Prevents Mis-insertion in Module Board
The key mechanism prevents mis-insertion in the module board.
6. Prevents Displacement of Module Board
The structure to sustain the module board on both sides prevents displacement of the module board.
7. Easy Insertion and Extraction of Module Board
The unique ejector mechanism facilitates to remove the module board. with pushing the injector. In addition, marginal space is not needed for insertion and extraction actions.
7.
sApplications
Workstations, computers, personal computers, PPC, business machines, measuring instruments, etc.
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sProduct Specifications
Operating Temperature Range Rating Voltage rating Current rating -55c to +85c 100V AC 0.5A Storage Temperature Range -55c to +85c
Item 1. Contact Resistance 2. Insulation Resistance 3. Withstanding voltage 4. Insulator/Extraction Force 5. Vibration 6. Moisture Resistance
Specification 30m ohms min. 1000M ohms min. No flashover or insulation breakdown. 196N max. No electrical discontinuity of 1s or more Contact resistance: 50m ohms max. Insulation Resistance: 1000M ohms min. Contact resistance: 50m ohms max. Insulation Resistance: 1000M ohms min. Contact resistance: 50m ohms max. Contact resistance: 50m ohms max. 100mA DC 250V DC 250V AC / 1 minute
Condition
Measured with the 1.370.002mm gauge Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 50 minutes in each of the 3 directions. 96 hours at temperature of 40c and humidity of 90% to 95% Tested for 5 cycles under following condition Temperature Time 30 cycles Exposed to density 5% salt water for 48 hours : -55 +5 to 35 +85 +5 to 35c : -30 10 to 15 +30 10 to 15 minutes
7. Temperature Cycle 8. Operating Life 9. Salt spray
sMaterial
Part Contact Insulator Ejector Material Phosphor copper PPS(UL94V-0) Polyamid Finish Selective gold plating
-----------------------------
sOrdering Information
SX4 A B - 168 S - 1.27 DSA
1 2 3 4 5 6 7 1 Series Name: SX4 2 DIMM Key:
A: 5V type B: 3.3V type
4 Number of Contacts: 168 5 Contact Type: Female 6 Contact Pitch: 1.27mm 7 Contact type (row interval x lead length)
DSA: 1.6mm x 3.5mm DSD: 1.27mm x 3.5mm DSH: 1.905mm x 3.5mm
3 Positioning boss
A: Without boss B: With boss
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s168 Contacts
Unit: mm Part Number SX4AB-168S-1.27DSA SX4BA-168S-1.27DSA SX4BA-168S-1.27DSD SX4AB-168S-1.27DSH CL No. 530-0100-8 530-0103-6 530-0112-7 530-0115-5
168
Number of Contacts
A 3.5 3.5 3.5 3.5
B 4.80 4.80 3.81 5.72
C 1.6 1.6 1.27 1.905
Boss With boss Without boss Without boss With boss
Voltage Key (Note) 5.0V 3.3V 3.3V 5.0V
Note : 3.3V and 5.0V correspond to the 8Byte DIMM voltage key.
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BPCB mounting pattern
q168 Contacts SX4AB-168S-1.27DSH
SX4BA-168S-1.27DSA,SX4AB-168S-1.27DSA
SX4BA-168S-1.27DSD
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BRecommended Module Board Dimensions
q168 Contacts
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sOperating Instruction
q168 Contacts
[Procedures for Board Insertion]
1. Adjust DIMM to the socket key direction. 2. Insert the DIMM along both socket sides and straight in the vertical direction to the mounting board. At this time, antivibration mechanism (protrusion) causes slight resistance to occur, but insert the DIMM until to hit the bottom. However, avoid slant and flap insertion, or slant engagement or half-insertion. 3. When the DIMM is inserted, it is engaged with a click tone.
[Procedures for Board Extraction]
1. Press the ejector in the vertical direction. 2. Pick up the DIMM with fingers, which floats slightly. Precautions 01. The ejector has strength enough to endure. However, if force is applied according to other operation methods instead of the Procedures for Handling Sockets, products could be damaged. 02. This product is designed in compliance with JEDEC "8 Byte DIMM". However, if other boards are used instead of the recommended module board or if the mounting devices are used the other than memory IC, troubles due to vibration or other failures could occur. Confirm individual conditions. 03. Acute angles at pad edges of recommended module boards could cause failure in contacts. Therefore, it is recommended to offset the tie-bar (0.1mm) from the center line, set the internal pad, or remove sharp edges or burrs according to the recommended size ranges. 04. Stand-off is provided for measures to prevent flux rise, but resin sealing is not done. Confirm individual conditions. 05. If strong heat is concentrated on the product (reflow, etc.), the product will be deformed due to strength. Check individual conditions. 06. Use alcohol-based flux solvent, which does not subject chemical reaction. 07. Don't provide convex or concave portions at external edges of the module board, or and chamfer areas at both edges. Comply with the recommended sizes. 08. The dip section tip is considered for safety, the tip is slimmed for enhancement of mountability. Be careful for handling products. 09. If the board is installed under other conditions, instead of conditions indicated in the connector mounting board and installation size pattern corresponding to individual products, failure could be caused. Observe the connector mounting board and installation size pattern, corresponding to individual products. 10. Note that slant or flap insertion could cause product damage. 11. Slant engagement or half-insertion could cause circuit short or fuming. 12. If force is given regardless the "Procedures for Handling Sockets", it will cause breakage. 13. Dusts inclusion in connector engagement areas will cause failure in the product. In addition, it is recommended to install SX41684S-DC (use a special cover. For details, consult HRS Sales Department) in the connector, which is not equipped with the module. 14. Even if the ejector is separated from the hinge connection area, operativity of the DIMM injector is not affected. However, don't forcibly remove the ejector lever. Such a behavior could cause the ejector lever to loosen.
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